Electroplated constant or E-constant is a specialized material used in microwave and radio frequency circuit applications such as printed circuit boards (PCBs).
Here are the steps involved in the manufacture of E-constant:
Base Material: Copper sheets of a specific thickness are chosen as the base material for E-constant.
Surface Preparation: The copper surface is cleaned using specialized chemicals to remove grease, oil, and other contaminants, ensuring proper adhesion of the electroplated layer.
Electroplating: Electroplating is the process of depositing a thin layer of E-constant on the surface of the copper sheet. This process involves the use of an electrolyte bath containing the necessary chemical composition of the E-constant, into which the copper sheet is immersed. An electrical current is then passed through the bath, which deposits a very thin layer of E-constant onto the copper surface. The thickness of the electroplated layer can be adjusted based on the required electrical properties.Heat
Treatment and Annealing: After the electroplating process, the copper sheet is treated with heat to stabilize the material and improve its adhesion with the copper surface.
Finishing: Finally, after the heat treatment is complete, the E-constant layer is coated with specialized materials to protect it from damage and provide an additional layer of adhesion. The finishing layer can be adjusted based on the desired electrical properties.
Overall, the manufacture of Electroplate Constant involves several precise and complex steps. The material must be carefully formulated, applied, and treated to ensure optimal adhesion and electrical performance.